TMS 2020 Annual Meeting & Exhibition

4:00 PM–4:20 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Lattice Hardening Due to Vacancy Diffusion in (GeTe)mSb2Te3 Alloys

Marriott Marquis Hotel - Miramar

4:00 PM–4:20 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Microstructure Evolution and Interfacial Growth of Intermetallic Compound for Cu/In/Cu Structure under Thermomigration

Marriott Marquis Hotel - Palomar

4:20 PM–4:40 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Realizing the Compositional Homogeneity in GeTe-based Thermoelectric Materials and Phase Transition Behavior

Marriott Marquis Hotel - Miramar

4:20 PM–4:40 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Role of Grain Boundaries in Electromigration and Thermomigration Related Failure : A Phase Field Simulation Study

Marriott Marquis Hotel - Palomar

4:40 PM–5:00 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Optimizing Power Factor in Rare Earth-free CoSb3-Skutterudite Thin Films

Marriott Marquis Hotel - Miramar

5:00 PM–5:20 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Severe Plastic Deformation (SPD) via High Pressure Torsion (HPT) a Perfect Tool not Only to Enhance ZT of Thermoelectric Materials but Also to Produce Them

Marriott Marquis Hotel - Miramar

5:20 PM–5:25 PM

Feb 26, 2020

(US - Pacific)

Electronic Materials

Concluding Comments

Marriott Marquis Hotel - Miramar

8:30 AM–12:00 PM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder: Solder Joint Intermetallics

Marriott Marquis Hotel - Palomar

8:30 AM–8:50 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

The Growth and Coarsening Kinetics of Ag3Sn in SAC305 Solders

Marriott Marquis Hotel - Palomar

8:50 AM–9:10 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Potential for Improving Sn-Cu Alloys as High-temperature Solders by the Suppression of Cu3Sn Phase

Marriott Marquis Hotel - Palomar

9:10 AM–9:30 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Effects of Secondary Reflow on Solder Joint Microstructure and Lifetime

Marriott Marquis Hotel - Palomar

9:30 AM–9:50 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Intermetallic Compound Analyses Provide Interfacial Reliability for Solder Connections in Electronics

Marriott Marquis Hotel - Palomar

9:50 AM–10:10 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Break

Marriott Marquis Hotel - Palomar

10:10 AM–10:30 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Influence of Substrates and Microalloying Additions on the Primary Intermetallic Growth of Lead-free Solder Joints

Marriott Marquis Hotel - Palomar

10:30 AM–10:50 AM

Feb 27, 2020

(US - Pacific)

Electronic Materials

Effect of Bi and Zn Addition to the Properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni Solder Coating

Marriott Marquis Hotel - Palomar

All Sessions

Lattice Hardening Due to Vacancy Diffusion in (GeTe)<sub>m</sub>Sb<sub>2</sub>Te<sub>3</sub> Alloys

Microstructure Evolution and Interfacial Growth of Intermetallic Compound for Cu/In/Cu Structure under Thermomigration

Realizing the Compositional Homogeneity in GeTe-based Thermoelectric Materials and Phase Transition Behavior

Role of Grain Boundaries in Electromigration and Thermomigration Related Failure : A Phase Field Simulation Study

Optimizing Power Factor in Rare Earth-free CoSb3-Skutterudite Thin Films

Severe Plastic Deformation (SPD) via High Pressure Torsion (HPT) a Perfect Tool not Only to Enhance ZT of Thermoelectric Materials but Also to Produce Them

Concluding Comments

Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder: Solder Joint Intermetallics

The Growth and Coarsening Kinetics of Ag3Sn in SAC305 Solders

Potential for Improving Sn-Cu Alloys as High-temperature Solders by the Suppression of Cu3Sn Phase

Effects of Secondary Reflow on Solder Joint Microstructure and Lifetime

Intermetallic Compound Analyses Provide Interfacial Reliability for Solder Connections in Electronics

Break

Influence of Substrates and Microalloying Additions on the Primary Intermetallic Growth of Lead-free Solder Joints

Effect of Bi and Zn Addition to the Properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni Solder Coating