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Additive Technologies

Utilization of Backscattered Electrons for Process Monitoring During Electron Beam Melting

9:10 AM–9:40 AM Feb 24, 2020 (US - Pacific)

San Diego Convention Ctr - 8

Description

Carolin Korner1, Christopher Arnold1, Christoph Breuning1; 1University of Erlangen-Nuremberg

During electron beam melting, demanding processing conditions such as high temperature, vacuum conditions and X-ray Radiation impede the continuous operation of standard process monitoring devices like light-optical camera systems. To overcome this deficit, detection of backscattered electrons is a highly promising approach. It delivers a signal, which is sensitive to variations of process parameters while the detector is unsusceptible to the harsh environmental conditions. A detection system for backscattered electrons is implemented in an in-house EBM system and used for the acquisition of electron optical images of the molten surfaces as well as for the record of the in-situ signal during melting. The data is correlated afterwards to the as-built specimens to demonstrate the high usability for process monitoring during EBM.
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