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Electronic Materials

Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX: Interfacial Reaction of Electronic Materials

8:00 AM–11:30 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

Who's Attending (8)
Sub-Sessions ( See all )
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Electronic Materials

Interfacial Reactions between Lead-free Solders and Electroless Co(B) Metallization

8:00 AM–8:20 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

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Electronic Materials

Interfacial Reaction in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples

8:20 AM–8:40 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

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Electronic Materials

Effects of Pd(P) Thickness on the Interfacial Reaction and Mechanical Properties of the Sn-3.5Ag/Au/Pd(P)/Ni(P) Microelectronic Joints

8:40 AM–9:00 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

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Electronic Materials

Effects of Copper Electroplating Parameters on the Copper-based Solder Joint Reactions

9:00 AM–9:20 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

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Electronic Materials

Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi Current Collectors

9:20 AM–9:40 AM Feb 24, 2020 (US - Pacific)

Marriott Marquis Hotel - Marina Ballroom E

Tags
AppSectionTechnical Program
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SessionTypeTechnical Paper Session